With CYT's new “Vision Inspection” technology, S720 can perform automatic alignment function for DUTs and is applicable for the measurement of dices after expansion. It combines one set of Probe Station (2 probes equipped), one Video Microscope, one LED Optical Spectral & Electrical Test Instrument and one IPC in a stand-alone machine frame. With such complete system design and integration by one site, either technical supports or after service would be offered more efficient and effective.

•  Vision Inspection
Machine vision performs automatic alignment of dice and makes the measurements of expanded dices available

•  System Integration
Complete integration with “Probe Station” and “Instrument” by one site, better technical supports and service would be available

•  High Throughput
18K PPH with auto-alignment and Iv, WL, Vf, Ir measurement

•  Binned Wafer Map
Real-time graphic depiction of “Binned Wafer Map” and “Mapping file” (compatible with Mapping Sorters) for pick-and-place are available

•  Video Microscope
Users can observe real-time probing status through monitor, without suffering fatigue as using conventional microscope

•  High Stability
Robust stand-alone type machine frame supports stable and vibration-free high speed measurement

•  Edge sensor Design
Probes equipped with edge sensors facilitate users to adjust the coplanarity of probing tips and automatic edge detection makes operation more easily

•  Applicable for various types of LED dices
The measurement of scribed, broken and expanded dices are available